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Plasma and Low-? Dielectric Materials. Interaction and Application in Advanced Semiconductor Technology

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With the scaling of devices, integration of porous ultra low-k materials into Cu interconnect becomes imperative. Low-k dielectric materials consist of methyl groups and pores incorporated into a silicon dioxide backbone structure to reduce the dielectric constant. Plasma is widely used in semiconductor industry for deposition, etching, stripping etc. This book explores the interaction between plasma and low-k dielectric materials and their application in advanced semiconductor processes. It...

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Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6391-5301-9
Объём: 216 страниц
Масса: 350 г
Размеры(высота, ширина, толщина), см: 23 x 16 x 2

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